Thermal Putty HY204 is a professional-grade thermal interface solution designed to maximize heat transfer between electronic components and cooling solutions. Perfect for CPUs, GPUs, chipsets, and other heat-sensitive devices, this putty ensures efficient cooling, safe insulation, and reliable performance across a wide temperature range. Its thick, gap-filling consistency makes it ideal for irregular surfaces where standard thermal pads or pastes may fall short.
Key Features
High Thermal Conductivity: 4.0 W/m·K ensures rapid heat transfer from components to heatsinks for optimal performance.
Generous Supply: Comes in a 100g package, ideal for multiple builds, upgrades, or repeated applications.
Universal Compatibility: Suitable for CPUs, VGAs, chipsets, LEDs, power supplies, and other electronics.
Safe & Non-Conductive: Electrically insulating and non-corrosive formula protects your components from shorts and damage.
Extreme Temperature Resistance: Operates efficiently from -50℃ to 340℃, ensuring stable performance under harsh conditions.
Gap-Filling Consistency: Semi-soft putty adapts to uneven surfaces, improving thermal contact and efficiency.
Specifications
Product Name: HY204 Thermal Putty
Thermal Conductivity: 4.0 W/m·K
Temperature Range: -50℃ to 340℃
Weight: 100g
Material: Synthetic resin with thermally conductive fillers (ceramic/metal oxides)
Electrical Conductivity: Non-conductive
Applications: CPUs, GPUs, chipsets, LED modules, power supplies, and other heat-generating electronics
Package Includes
1 x 100g HY204 Thermal Putty