Mechanic QC20 BGA IC Glue Remover is a professional-grade liquid solution designed to easily remove sealing or resinating glue from BGA IC chips on mobile phones and other electronic devices. It effectively softens and loosens various types of solidified adhesive without damaging the circuit board or nearby components, making it a must-have for precision repair work.
Features:
20ml BGA IC glue and epoxy remover for professional electronic repair use.
Quickly softens and loosens hardened adhesives such as epoxy, acrylate, polyurethane, phenolics, and organosilicon.
Safe for circuit boards — will not damage PCB tracks or surrounding components.
Environmentally friendly and benzene-free formulation, safe for regular workshop use.
Convenient and easy to apply with absorbent cotton or swab.
Effectively removes glue from the sides and underneath BGA IC chips.
How to Use:
Use tweezers to pick a piece of absorbent cotton larger than the BGA IC.
Dip it into the remover liquid and cover the chip completely.
Place a plastic film or bag over the board and wait for about 20 minutes.
Repeat steps 1–3 if needed for better results.
Remove softened glue around the IC gently with tweezers or a small tool.
Heat the chip using a hot air gun (~300°C) to soften the bottom glue.
Carefully lift the chip using tweezers or a precision cutter.
Specifications:
Brand: Mechanic
Model: QC20
Type: BGA IC Glue / Epoxy Remover
Capacity: 20ml
Application: BGA chip glue removal for mobile phones and electronic devices
Safe Composition: No benzene or harmful derivatives
Package Includes:
1 x Mechanic QC20 BGA IC Glue Remover (20ml)