Mechanic BGA Reballing Solder Balls (Sn63Pb37 Alloy) 0.35mm Leaded Solder Balls for IC & Chip Rework is high-purity Sn63Pb37 leaded solder spheres designed for BGA chip reballing, IC repair, and micro-soldering applications. These precision-engineered solder balls provide excellent consistency, quick melting, and strong bonding, making them ideal for professional motherboard, CPU, GPU, and logic board repair work.
Manufactured with 99.99% pure tin and a eutectic alloy ratio of 63% Sn / 37% Pb, these solder balls ensure smooth solder flow and reliable joint strength with a melting point of 183°C, allowing technicians to achieve high-quality and durable solder joints with minimal effort.
Key Features:
High-Quality Alloy Composition: Sn63Pb37 eutectic alloy provides stable melting and strong conductivity.
Low Melting Point (183°C): Perfect for delicate BGA reballing and IC repair work without overheating components.
Ultra-High Purity: Made from 99.99% pure tin for consistent soldering performance.
Precision Diameter (0.35mm): Uniform size ensures even heat distribution and reliable reflow.
Perfect for BGA & CSP Chips: Suitable for reballing CPU, GPU, NAND, and other IC chips.
Professional-Grade Performance: Ideal for technicians in mobile, laptop, and PCB repair industries.
High Quantity (10,000 Pcs): Each container includes 10,000 precision solder balls for long-term use.
Reliable Brand: Manufactured by MECHANIC (ç¶ä¿®ä½¬) – a trusted name in professional electronic repair tools.
Specifications:
Product Name: BGA Reballing Leaded Solder Balls
Brand: MECHANIC
Alloy Composition: Sn63Pb37 (63% Tin / 37% Lead)
Melting Point: 183°C
Diameter / Size: 0.35mm
Purity: 99.99%
Quantity: 10,000 Pcs per bottle
Application: BGA, CSP, and micro-soldering on motherboards, logic boards, and chipsets
Packing Include:
1 × Bottle of Mechanic BGA Reballing Solder Balls (10,000 pcs, 0.35mm)